Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476572 | Method for fabricating electronic package structure | Chih-Yuan Shih, Chih-Hsien Chiu, Yueh-Chiung Chang, Chi-Pin Tsai, Chien-Cheng Lin +3 more | 2022-10-18 |
| 11437325 | Electronic device, electronic package and packaging substrate thereof | Ho-Chuan Lin, Hsiu-Fang Chien, Chih-Yuan Shih | 2022-09-06 |