Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11406018 | Double-sided and multilayer flexible printed circuit (FPC) substrate and method of processing the same | Sui-Ho Tsai, Cheng-Neng Chen, Chih-Yuan Chao, Hsueh-Tsung Lu | 2022-08-02 |
| 11353166 | Circuit board arrangement to prevent overvoltage and arcing | Zhaoting Li, Peng Chen, Han Lu, Feng Wang, Wei Xia +1 more | 2022-06-07 |