Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11406018 | Double-sided and multilayer flexible printed circuit (FPC) substrate and method of processing the same | Sui-Ho Tsai, Yun-Nan Wang, Chih-Yuan Chao, Hsueh-Tsung Lu | 2022-08-02 |