Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11309224 | Folded substrate for stacked integrated circuit devices | Yasuyoshi Horikawa, Yoshihiro Ihara, Hikaru Tanaka | 2022-04-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11309224 | Folded substrate for stacked integrated circuit devices | Yasuyoshi Horikawa, Yoshihiro Ihara, Hikaru Tanaka | 2022-04-19 |