Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437174 | Inductor and method of manufacturing same | Tsukasa Nakanishi, Kazuyuki Okita, Yukihiro Miyasaka | 2022-09-06 |
| 11309224 | Folded substrate for stacked integrated circuit devices | Yoshihiro Ihara, Yoshihiro Kita, Hikaru Tanaka | 2022-04-19 |