Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476182 | Assembly of flexible and integrated module packages with leadframes | Zhiquan Luo, Jawad Nasrullah | 2022-10-18 |
| 11329734 | Method and apparatus to use active semiconductor interposers for RF signal chain in modular stacked integrated circuits | Jawad Nasrullah, Hanfeng Wang, Mohamed Sameh Mahmoud | 2022-05-10 |