Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476182 | Assembly of flexible and integrated module packages with leadframes | Zhiquan Luo, Omar Alnaggar | 2022-10-18 |
| 11361138 | Over-the-air hardware update | Hao Hua | 2022-06-14 |
| 11329734 | Method and apparatus to use active semiconductor interposers for RF signal chain in modular stacked integrated circuits | Omar Alnaggar, Hanfeng Wang, Mohamed Sameh Mahmoud | 2022-05-10 |