Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11344976 | Solder material, solder paste, and solder joint | Hiroyoshi Kawasaki, Hiroki Sudo, Takahiro Roppongi, Hiroshi Okada, Daisuke Soma +4 more | 2022-05-31 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11344976 | Solder material, solder paste, and solder joint | Hiroyoshi Kawasaki, Hiroki Sudo, Takahiro Roppongi, Hiroshi Okada, Daisuke Soma +4 more | 2022-05-31 |