Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538686 | Semiconductor structure and method for forming the same | Zhu Chen, Yang Ming, Bei Duohui, Chao Zhang, Ni Bai Bing | 2022-12-27 |
| 11373949 | Interconnect structure having metal layers enclosing a dielectric | Ji Zhu | 2022-06-28 |