Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450582 | Wafer-level package structure | Hailong LUO | 2022-09-20 |
| 11335810 | Method and system for fabrication of a vertical fin-based field effect transistor | Ray Milano, Subhash Srinivas Pidaparthi, Andrew P. Edwards, Hao Cui, Shahin Sharifzadeh | 2022-05-17 |
| 11315884 | Method and system for fabricating fiducials using selective area growth | Ray Milano, Robert Routh, Subhash Srinivas Pidaparthi, Andrew P. Edwards | 2022-04-26 |