Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450582 | Wafer-level package structure | Clifford Drowley | 2022-09-20 |
| 11444244 | Mask plate and fabrication method thereof | Mengbin Liu | 2022-09-13 |
| 11309279 | Package structure of wafer-level system-in-package | Mengbin Liu | 2022-04-19 |