Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11399439 | Methods of forming high aspect ratio plated through holes and high precision stub removal in a printed circuit board | Shinichi Iketani, Dale Kersten | 2022-07-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11399439 | Methods of forming high aspect ratio plated through holes and high precision stub removal in a printed circuit board | Shinichi Iketani, Dale Kersten | 2022-07-26 |