Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11399439 | Methods of forming high aspect ratio plated through holes and high precision stub removal in a printed circuit board | Douglas Ward Thomas, Shinichi Iketani | 2022-07-26 |
| 11246226 | Laminate structures with hole plugs and methods of forming laminate structures with hole plugs | Shinichi Iketani | 2022-02-08 |