Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508711 | Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer | Takeki Ninomiya | 2022-11-22 |
| 11450624 | Semiconductor die including diffusion barrier layers embedding bonding pads and methods of forming the same | Noriaki Oda | 2022-09-20 |
| 11444039 | Semiconductor die including diffusion barrier layers embedding bonding pads and methods of forming the same | Noriaki Oda | 2022-09-13 |
| 11393836 | Three-dimensional memory device with separated source-side lines and method of making the same | Masanori Tsutsumi, Shinsuke Yada, Mitsuteru Mushiga, Akio Nishida, Hiroyuki Ogawa | 2022-07-19 |
| 11322466 | Semiconductor die containing dummy metallic pads and methods of forming the same | — | 2022-05-03 |