Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450624 | Semiconductor die including diffusion barrier layers embedding bonding pads and methods of forming the same | Teruo Okina | 2022-09-20 |
| 11444039 | Semiconductor die including diffusion barrier layers embedding bonding pads and methods of forming the same | Teruo Okina | 2022-09-13 |