Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482292 | Non-volatile storage with processive writes | Daniel Linnen, Khanfer A. Kukkady, Preston A. Thomson | 2022-10-25 |
| 11462497 | Semiconductor device including coupled bond pads having differing numbers of pad legs | Daniel Linnen, Jayavel Pachamuthu | 2022-10-04 |
| 11456272 | Straight wirebonding of silicon dies | Daniel Linnen, Jayavel Pachamuthu | 2022-09-27 |
| 11450575 | System and method for die crack detection in a CMOS bonded array | Jayavel Pachamuthu, Daniel Linnen | 2022-09-20 |
| 11372056 | Circuit for detecting pin-to-pin leaks of an integrated circuit package | Dat Tran, Loc Tu, Nyi Nyi Thein | 2022-06-28 |
| 11222865 | Semiconductor device including vertical bond pads | Daniel Linnen, Jayavel Pachamuthu | 2022-01-11 |