Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462497 | Semiconductor device including coupled bond pads having differing numbers of pad legs | Kirubakaran Periyannan, Daniel Linnen | 2022-10-04 |
| 11456272 | Straight wirebonding of silicon dies | Kirubakaran Periyannan, Daniel Linnen | 2022-09-27 |
| 11450575 | System and method for die crack detection in a CMOS bonded array | Kirubakaran Periyannan, Daniel Linnen | 2022-09-20 |
| 11422736 | Memory controller for resolving string to string shorts | Rajan Paudel, Deepak Bharadwaj | 2022-08-23 |
| 11222865 | Semiconductor device including vertical bond pads | Kirubakaran Periyannan, Daniel Linnen | 2022-01-11 |