Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488937 | Semiconductor package with stack structure and method of manufacturing the semiconductor package | Hyunsoo Chung, Myungkee Chung | 2022-11-01 |
| 11222882 | Semiconductor package including dummy chip on a first semiconductor chip and laterally spaced apart from a second semiconductor chip | — | 2022-01-11 |