Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488937 | Semiconductor package with stack structure and method of manufacturing the semiconductor package | Hyunsoo Chung, Younglyong Kim | 2022-11-01 |
| 11430772 | Semiconductor package | Hyunsoo Chung, Taewon Yoo | 2022-08-30 |
| 11362054 | Semiconductor package and method of manufacturing the same | Hyunsoo Chung, Taewon Yoo | 2022-06-14 |
| 11296004 | Semiconductor package including heat redistribution layers | Taewon Yoo, Hyunsoo Chung | 2022-04-05 |