Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11539138 | Chip radio frequency package and radio frequency module | Hak Gu Kim, Ho Kyung KANG, Seong Jong CHEON, Young Sik Hur, Jin Seon Park | 2022-12-27 |
| 11495546 | Substrate having electronic component embedded therein | Je Sang Park, Chang Yul Oh, Sang Ho Jeong | 2022-11-08 |
| 11382213 | Printed circuit board | Kee Su Jeon, Sang Hoon Kim, Min Jae Seong | 2022-07-05 |
| 11251133 | Substrate having electronic component embedded therein | Dae Jung Byun, Chang Hwa Park, Sang Ho Jeong, Ki Ho Na, Je Sang Park +1 more | 2022-02-15 |
| 11244905 | Substrate with electronic component embedded therein | Je Sang Park, Chang Yul Oh, Sang Ho Jeong | 2022-02-08 |