Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11490503 | Substrate with electronic component embedded therein | Chi Seong Kim, Eun Heay Lee, Yo Han SONG, Gun Hwi Hyung, Jae Heun LEE +2 more | 2022-11-01 |
| 11251133 | Substrate having electronic component embedded therein | Dae Jung Byun, Sang Ho Jeong, Ki Ho Na, Je Sang Park, Yong-duk Lee +1 more | 2022-02-15 |
| 11229118 | Printed circuit board | — | 2022-01-18 |