Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532581 | Semiconductor devices having bonding structures with bonding pads and metal patterns | Hyoungyol Mun, Sangjun Park, Kyuha Lee | 2022-12-20 |
| 11527524 | Semiconductor device | Youngbum Woo, Byungkyu Kim, Eunji Kim, Seungwoo Paek | 2022-12-13 |