Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532581 | Semiconductor devices having bonding structures with bonding pads and metal patterns | Uidam Jung, Hyoungyol Mun, Sangjun Park | 2022-12-20 |
| 11362067 | Methods of manufacturing semiconductor devices | Pilkyu Kang, Seokho Kim, Hoonjoo Na, Kwangjin Moon, Jaehyung Park +2 more | 2022-06-14 |
| 11348892 | Semiconductor devices including bonding layer and adsorption layer | Jaehyung Park, Seokho Kim, Hoonjoo Na, Kwangjin Moon, Joohee Jang | 2022-05-31 |
| 11296045 | Semiconductor device and method of manufacturing the same | Joohee Jang, Seokho Kim, Hoonjoo Na, Jaehyung Park | 2022-04-05 |