Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11373932 | Semiconductor packages including through holes and methods of fabricating the same | Hyoukyung Cho, Daesuk Lee, Jinnam Kim, Kwangjin Moon, Hakseung Lee | 2022-06-28 |
| 11295981 | Semiconductor devices including through vias and methods of fabricating the same | Yi Koan Hong, Kwangjin Moon | 2022-04-05 |