Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11373932 | Semiconductor packages including through holes and methods of fabricating the same | Daesuk Lee, Jinnam Kim, Taeseong Kim, Kwangjin Moon, Hakseung Lee | 2022-06-28 |
| 11315894 | Semiconductor stack and method for manufacturing the same | Hyungjun Jeon, Kwangjin Moon, Hakseung Lee | 2022-04-26 |