Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11446878 | Ultrasonic bonding apparatus and method for ultrasonic bonding using the same | Chan-Jae Park, Minsoo Kim, Yoona Kim, Soo Yeon HAN, Kikyung Youk +2 more | 2022-09-20 |
SO
SUNOK OH
Overall (2022): #244,888 of 548,613Top 45%
1
Patents 2022