Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11446878 | Ultrasonic bonding apparatus and method for ultrasonic bonding using the same | Chan-Jae Park, Minsoo Kim, Yoona Kim, SUNOK OH, Kikyung Youk +2 more | 2022-09-20 |
SH
Soo Yeon HAN
Overall (2022): #254,451 of 548,613Top 50%
1
Patents 2022