Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450644 | Semiconductor package having a reinforcement layer | Byoung Jun Ahn | 2022-09-20 |
| 11412197 | Electronic device including image sensor | Sung-Ho CHA | 2022-08-09 |
| 11217540 | Semiconductor package including nonconductive film having controlled tail portion | — | 2022-01-04 |