BA

Byoung Jun Ahn

SH Sk Hynix: 1 patents #418 of 1,029Top 45%
Overall (2022): #508,341 of 548,613Top 95%
1
Patents 2022

Issued Patents 2022

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11450644 Semiconductor package having a reinforcement layer Sung Su Kim 2022-09-20