Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482453 | Method of manufacturing a semiconductor device using a thermally decomposable layer, a semiconductor manufacturing apparatus, and the semiconductor device | Seung Heon Lee, Jaekang Koh, Tae-Jong Han | 2022-10-25 |
| 11393827 | Methods of fabricating semiconductor device | Seung Heon Lee, ByeongJu Bae | 2022-07-19 |
| 11264294 | Integrated circuit devices and manufacturing methods for the same | Seungheon Lee, Jaekang Koh, Hyukwoo Kwon, Taejong Han | 2022-03-01 |