Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482453 | Method of manufacturing a semiconductor device using a thermally decomposable layer, a semiconductor manufacturing apparatus, and the semiconductor device | Seung Heon Lee, Munjun Kim, Tae-Jong Han | 2022-10-25 |
| 11264294 | Integrated circuit devices and manufacturing methods for the same | Seungheon Lee, Hyukwoo Kwon, Munjun Kim, Taejong Han | 2022-03-01 |