Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11362053 | Semiconductor chip formed using a cover insulation layer and semiconductor package including the same | Eunyoung Jeong, Junghoon Han | 2022-06-14 |
JL
Juik Lee
Overall (2022): #386,685 of 548,613Top 75%
1
Patents 2022