Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11362053 | Semiconductor chip formed using a cover insulation layer and semiconductor package including the same | Juik Lee, Junghoon Han | 2022-06-14 |
EJ
Eunyoung Jeong
Overall (2022): #460,234 of 548,613Top 85%
1
Patents 2022