Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11251169 | Method of fabricating semiconductor package and semiconductor package | Tae Young Lee, Dongok Kwak, Boseong Kim, Sang-Sub Song | 2022-02-15 |
JO
Joonyoung Oh
Overall (2022): #393,174 of 548,613Top 75%
1
Patents 2022