Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11315849 | Semiconductor package having stiffener | Suchang LEE | 2022-04-26 |
| 11251169 | Method of fabricating semiconductor package and semiconductor package | Tae Young Lee, Boseong Kim, Sang-Sub Song, Joonyoung Oh | 2022-02-15 |