Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437307 | Device comprising first solder interconnects aligned in a first direction and second solder interconnects aligned in a second direction | Abdolreza Langari, Yuan LI, Terence Cheung, Ching-Liou Huang, Hui Wang | 2022-09-06 |