Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437307 | Device comprising first solder interconnects aligned in a first direction and second solder interconnects aligned in a second direction | Abdolreza Langari, Yuan LI, Shrestha Ganguly, Ching-Liou Huang, Hui Wang | 2022-09-06 |