Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11439008 | Package with substrate comprising variable thickness solder resist layer | Kun Fang, Jaehyun Yeon, Suhyung Hwang, Hyunchul CHO | 2022-09-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11439008 | Package with substrate comprising variable thickness solder resist layer | Kun Fang, Jaehyun Yeon, Suhyung Hwang, Hyunchul CHO | 2022-09-06 |