Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11439008 | Package with substrate comprising variable thickness solder resist layer | Jaehyun Yeon, Suhyung Hwang, Hyunchul CHO, Boyu Tseng | 2022-09-06 |
| 11429534 | Addressing cache slices in a last level cache | Prakash Bangalore Prabhakar, James M. Van Dyke | 2022-08-30 |