Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532575 | Integrated antenna package structure and manufacturing method thereof | Han-Wen Lin, Hung-Hsin Hsu, Shang-Yu Chang Chien | 2022-12-20 |
| 11456243 | Semiconductor package structure and manufacturing method thereof | Hung-Hsin Hsu, Shang-Yu Chang Chien | 2022-09-27 |
| 11367678 | Package structure and manufacturing method thereof | Shang-Yu Chang Chien, Hung-Hsin Hsu, Chia-Yu Hung | 2022-06-21 |
| 11309296 | Semiconductor package and manufacturing method thereof | Hung-Hsin Hsu, Shang-Yu Chang Chien, Wen-Hsiung Chang | 2022-04-19 |
| 11309283 | Packaging structure and manufacturing method thereof | Shang-Yu Chang Chien, Hung-Hsin Hsu | 2022-04-19 |
| 11296041 | Integrated antenna package structure and manufacturing method thereof | Shang-Yu Chang Chien, Hung-Hsin Hsu | 2022-04-05 |
| 11257747 | Semiconductor package with conductive via in encapsulation connecting to conductive element | Wen-Jeng Fan, Shang-Yu Chang Chien, Hung-Hsin Hsu | 2022-02-22 |
| 11251170 | Package structure and manufacturing method thereof | Shang-Yu Chang Chien, Hung-Hsin Hsu | 2022-02-15 |