Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11522000 | Semiconductor package structure and manufacturing method thereof | Hung-Hsin Hsu | 2022-12-06 |
| 11309296 | Semiconductor package and manufacturing method thereof | Nan-Chun Lin, Hung-Hsin Hsu, Shang-Yu Chang Chien | 2022-04-19 |