Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437336 | Semiconductor package structure with landing pads and manufacturing method thereof | Jeffrey Wang, Jen-I Huang | 2022-09-06 |
| 11289401 | Semiconductor package | — | 2022-03-29 |