Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437336 | Semiconductor package structure with landing pads and manufacturing method thereof | Jeffrey Wang, Kun-Yung Huang | 2022-09-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437336 | Semiconductor package structure with landing pads and manufacturing method thereof | Jeffrey Wang, Kun-Yung Huang | 2022-09-06 |