Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11478822 | Wafer level ultrasonic chip module having suspension structure and manufacturing method thereof | Yu Jin, Qian Zhao, Yi-Hsiang Chiu, Huan Liu, Hung-Ping Lee +1 more | 2022-10-25 |
| 11460341 | Wafer scale ultrasonic sensor assembly and method for manufacturing the same | Yu Jin, Yi-Hsiang Chiu, Hung-Ping Lee, Dan Gong | 2022-10-04 |