Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11478822 | Wafer level ultrasonic chip module having suspension structure and manufacturing method thereof | Yu Jin, Sheng-Lin Ma, Yi-Hsiang Chiu, Huan Liu, Hung-Ping Lee +1 more | 2022-10-25 |