Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11401393 | Prepreg, metal-clad laminate, and wiring board | Mikio Sato, Yasunori HOSHINO, Masashi Koda, Takayoshi Ozeki, Hiroaki Fujiwara | 2022-08-02 |
| 11351755 | Metal-clad laminate, printed wiring board and metal foil with resin | Hiroaki Fujiwara, Mikio Sato | 2022-06-07 |
| 11254100 | Metal-clad laminate and metal foil with resin | Akira IRIFUNE, Yuki Inoue, Yuki Tokuda | 2022-02-22 |
| 11242425 | Resin composition, prepreg, resin-added film, resin-added metal foil, metal-clad layered plate, and wiring plate | Mikio Sato, Hiroaki Fujiwara, Masashi Koda, Yasunori HOSHINO, Takayoshi Ozeki | 2022-02-08 |