Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11401393 | Prepreg, metal-clad laminate, and wiring board | Yuki Kitai, Mikio Sato, Yasunori HOSHINO, Takayoshi Ozeki, Hiroaki Fujiwara | 2022-08-02 |
| 11242425 | Resin composition, prepreg, resin-added film, resin-added metal foil, metal-clad layered plate, and wiring plate | Mikio Sato, Hiroaki Fujiwara, Yuki Kitai, Yasunori HOSHINO, Takayoshi Ozeki | 2022-02-08 |