Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11330710 | Metal-clad laminated board, metal member provided with resin, and wiring board | Hirohisa Goto, Tomoyuki Abe | 2022-05-10 |
| 11312858 | Resin composition, prepreg, film including resin, metal foil including resin, metal-clad laminate, and wiring board | Fumito Suzuki, Shunji Araki, Hirohisa Goto, Yuki Inoue | 2022-04-26 |
| 11267225 | Metal-clad laminated board, method for producing metal-clad laminated board, resin-attached metal member, method for producing resin-attached metal member, wiring board and method for producing wiring board | Tomoyuki Abe, Shunji Araki, Yuki Inoue | 2022-03-08 |