Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11312858 | Resin composition, prepreg, film including resin, metal foil including resin, metal-clad laminate, and wiring board | Tatsuya Arisawa, Fumito Suzuki, Hirohisa Goto, Yuki Inoue | 2022-04-26 |
| 11267225 | Metal-clad laminated board, method for producing metal-clad laminated board, resin-attached metal member, method for producing resin-attached metal member, wiring board and method for producing wiring board | Tatsuya Arisawa, Tomoyuki Abe, Yuki Inoue | 2022-03-08 |