Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11407869 | Prepreg, metal-clad laminate and printed wiring board | Rihoko Watanabe, Hiroharu Inoue | 2022-08-09 |
| 11234329 | Prepreg, substrate, metal-clad laminate, semiconductor package, and printed circuit board | Rihoko Watanabe, Hiroharu Inoue | 2022-01-25 |